Deutsche Telekom said it has developed the nuSIM for low-cost devices to use in mobile IoT applications with a long life-span such as asset trackers and smart motion or temperature sensors.
NuSim has the functionality of a SIM card built in a chipset. It will be available for sale in the second half of 2019. Deutsche Telekom has partnered for the chipset development with Altair Semiconductor, Commsolid/Goodix, HiSilicon, Nordic Semiconductor, Qualcomm Technologies, Samsung Electronics and Sequans Communications and for the modules with Quectel Wireless Solutions, Sierra Wireless, Telit and U-blox. The digital security is based on Giesecke+Devrient Mobile Security.